A delegation from Thai Binh Duong University, led by Mr. Nguyen Thanh Hung, Head of the Admissions and Communications Department, has just concluded its visit and working sessions in Taiwan (China). The trip was part of the INTENSE program, which aims to promote international educational cooperation between Taiwan and Vietnam in the fields of STEM education, Finance, and Semiconductors.
Memorandum of Understanding Signing
A highlight of the trip was the signing of a Memorandum of Understanding (MOU) to implement the INTENSE program between Thai Binh Duong University and eight prestigious Taiwanese universities, including National Yang Ming Chiao Tung University, Tatung University, Dayeh University, and Ming Chi University of Technology.
In addition, the delegation had the opportunity to visit and exchange experiences at semiconductor research institutes and training centers; witness firsthand the modern laboratories, advanced equipment, and high-tech application training models at partner universities. Moreover, the meetings and seminars facilitated in-depth exchanges on training programs, teaching methods, and employment opportunities in Taiwan.
Opportunities for Study and Work in Taiwan
Under the cooperation agreement, students from Thai Binh Duong University will have the opportunity to enroll in transfer programs at leading Taiwanese universities of science and technology with attractive benefits such as: airfare subsidies, tuition waivers, and living expense support. Upon graduation, students will be offered employment at renowned Taiwanese technology companies.
Expanding international cooperation
Mr. Nguyen Thanh Hung, Head of the Delegation, shared: “This trip marks a significant step forward in the university’s internationalization strategy. We believe that cooperating with leading Taiwanese universities will contribute to enhancing the quality of training in STEM fields and Semiconductors, meeting the demand for high-quality human resources for the development of the microchip industry in Vietnam.”
Article and photo: Admissions & Communications Department